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Arquimea&IHP - Cooperation in space microelectronics
ARQUIMEA and IHP MICROELECTRONICS sign an agreement for cooperation in space microelectronics
12/01/2015

ARQUIMEA and the German organisation IHP Microelectronics have signed a collaboration agreement for the joint development, promotion and commercialization of IC parts and processes based on IHP technologies for space applications. In this partnership IHP provides foundry services and ARQUIMEA offers support to IC design, digital back-end and test services.

IHP performs research and development in the fields of silicon-based systems, highest-frequency integrated circuits, and technologies for wireless and broadband communication. The focus of research at the institute is oriented towards issues relevant for business, resulting in applications for telecommunications, semiconductor and automotive industries, aerospace, telemedicine, and automation technologies. The institute has developed into an internationally recognized competence center for Silicon-Germanium (SiGe) technologies.

IHP offers research partners and customers access to its powerful SiGe BiCMOS technologies and special integrated RF modules. The company has at its disposal an 8” (200 mm) pilot line for chip manufacturing as well as design kits, IC blocks and the required design tools.